flexible double-sided printed board是什么意思

网络释义

用法例句

Lecture series on final surface finishing process for PCB -Ⅱ Process of replacement Sn plating for super thin flexible PCB with super density;

印制板的表面终饰工艺系列讲座 第二讲 超薄型超高密度挠性印制板的置换镀锡工艺

3-layer halogen-free FCCL was used to prepare double side FPC.

使用无卤三层法挠性覆铜板(FCCL)制备一款双面挠性印制电路板(FPC),在钻孔、沉镀铜、层压、化学镀金等关键的制程后检测基材的尺寸稳定性,结果表明该无卤FCCL具备优异的尺寸稳定性和可加工性。

Specification for single and double sided flexible printed boards with through connections

GB/T14515-1993有贯穿连接的单、双面挠性印制板技术条件

Specification for single and double sided flexible printed boards without through connections

GB/T14516-1993无贯穿连接的单、双面挠性印制板技术条件

Research on the Process of Buried/blind Via in HDI Rigid-flex Board

HDI刚挠印制板中的埋盲孔工艺研究

Lead-Free Process Compatible No-Flow Prepreg for Rigid-Flex PCB

应用于刚挠印制板无铅工艺兼容的不流动性半固化片

Printed boards--Part 10: Specification for flex-rigid double-sided printed boards with through connections

GB/T4588.10-1995印制板第10部分:有贯穿连接的刚挠双面印制板规范

Adhesive coated polyester film for flexible printed circuits

GB/T14708-1993挠性印制电路用涂胶聚酯薄膜

Adhesive coated polyimide film for flexible printed circuits

GB/T14709-1993挠性印制电路用涂胶聚酰亚胺薄膜

Test methods for flexible copper-clad material for printed circuits

GB/T13557-1992印制电路用挠性覆铜箔材料试验方法

Flexible copper-clad polyimide film for printed circuits

GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜

Flexible copper-clad polyester film for printed circuits

GB/T13556-1992印制电路用挠性覆铜箔聚脂薄膜

Chemical Etching to Manufacture Double Access Single-side FPC

化学蚀刻法制作双面连接的单面挠性板

Optimization Design for Parameters of Satellite Attitude Control System with Flexible Solar Array

带挠性帆板的卫星姿态控制系统参数优化设计

Influence of Satellite Control Force on Its Flexible Solar Panel during Orbit Maneuver

卫星轨道控制力对挠性帆板振动的影响

Research on Flexible Materials and Adhesives for Rigid-Flex Boards

刚挠结合板用挠性材料和粘结材料性能研究

flexible shaft type level controller

挠性轴式液位控制器

Development and Application of Surface Deflection Auto-measuring Equipment

面板挠度自动测量装置的研制及应用

High-density IC Packaging Based on Flexible Printed Circuit

基于挠性基板的高密度IC封装技术

Test method of solderability for printed boards

GB/T4677.10-1984印制板可焊性测试方法