This paper studies the influence rule of the blade's vibration and the surface roughness, warp, total thickness variation (TTV) of the wafers, study the abrasi.
本文系统研究了内圆锯切过程中,锯片振动对硅晶片表面粗糙度、弯曲度、总厚度变化(TTV)的影响规律。
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