taber-type deflashers是什么意思

网络释义

用法例句

Through taking up new techniques, for example round storehouse, frequency change for controlling speed,electric belt weighing, etc, the normal production of two sinter plant is ensured and the equipment level of primary mixing system is increased.

针对预配料仓数量不能满足优化配料工艺要求的情况 ,提出并实施了预配料仓与厂房扩建工程的不停产改造与扩建 ,采用了圆台型料仓、变频调速、电子皮带称量PID等新技术 ,保证了两个烧结厂的正常生产 ,提高了预配料系统的装备水平 ,为实施优化配料生产工艺创造了良好条

It is found that the dominant material removal mechanism in precision grinding of n- Al2O3/13TiO2 coatings is as brittle fracture including chippping and crushing which is added with.

应用扫描电镜对纳米结构Al2O3/13TiO2(n-Al2O3/13TiO2)涂层精密磨削后的表面/亚表面形貌进行观察和分析,结合对n-Al2O3/13TiO2 精密磨削的单颗磨粒磨削力、磨削力分力比和比磨削能的磨削实验结果的分析,揭示了n-Al2O3/13TiO2 涂层精密磨削的材料去除机理。

It is necessary to study the material removal mechanism in grinding of nanostructured ceramic coatings.

纳米结构陶瓷涂层具有优异的性能,但在工业应用中不但其涂层制备技术而且其精密磨削技术对涂层的使用性能均具有重要影响,因此对其磨削时的材料去除机理的研究成为必要。

The material removal mechanism into abrasive jet precision finishing machining with grinding wheel as restraint was investigated,based on the size ratio of characteristic particle size to film thickness between grinding wheel and workpiece.

基于磨粒特征尺寸与砂轮、工件间液膜厚度比值的变化,研究了砂轮约束磨粒喷射精密光整加工材料去除机理。

Detection of Subsurface Damage and Material Removal Mechanism in Optical Polishing Process

光学材料抛光亚表面损伤检测及材料去除机理

Study on Material Removal Mechanism for Non-contact CMP;

非接触化学机械抛光的材料去除机理研究

Research on the Material Removal Mechanism of Semi-Fixed Abrasive Tool

基于半固着磨粒磨具加工的材料去除机理研究

Experimental and Theoretical Study on the Material Removal in the Chemical Mechanical Polishing at Molecular Scale;

基于分子量级的化学机械抛光材料去除机理的理论和试验研究

Study on the Mechanism and Arts of Magnetorheological Finishing (MRF) by Nano-sized Diamond Abrasives

纳米金刚石磨料磁流变抛光材料去除机理与工艺研究

Surface Morphology and Material-removal Mechanism in Grinding of Nanostructured Tungsten Carbide

纳米结构硬质合金磨削的表面形貌和材料去除机理研究

Study on the Material Adhesion Removal Mechanism in Chemical Mechanical Polishing of Silicon Wafers

芯片化学机械抛光过程中材料吸附去除机理的研究

Material Removing Mechanism for Mechanical Lapping of Diamond Cutting Tools

金刚石刀具机械研磨过程中材料的去除机理(英文)

Material removal characteristic of silicon wafers in chemical mechanical polishing

单晶硅片化学机械抛光材料去除特性

Study on Shaped Machining of the Special-shaped Surface of Granite and Mechanism of Material Rupture;

花岗石异型面成形加工及材料断裂去除机理研究

Study on material removal theoretical model of zone polishing technology

环带抛光技术材料去除理论模型研究

Utilization of Native Botanic Material as Sorbent for Removal of Ionic Dyes from Aqueous Solution and Study of Adsorption Mechanism;

天然植物材料作为吸附剂去除水溶液中离子型染料及吸附机理的研究

Research of the Mechanism of Material Erosion Based on Single Pulse in EDM;

基于单脉冲电火花加工的材料蚀除机理研究

"Remove the plastic wrapping, adhesive tape and Styrofoam from the balance."

去除塑料薄膜、胶带和泡沫材料

Biomimetic Fat Adsoluble Agent Preparation and Its Use for Removal of Hydrophobic Organic Contaminants in Aqueous Solution;

仿生脂肪吸溶材料制备及对水体中疏水性有机污染物去除的研究

Preparation of Activated Carbon/Iron Oxide Composite Materials and Studies on Removal of Organic Compounds and Arsenic from Water;

氧化铁/活性炭复合材料的制备及去除水中有机物和砷的研究

Analysis on Hydrodynamics and Material Removal Rate of Circular Translational CMP;

圆平动化学机械抛光的流体动力性能及材料去除率研究

Research on Modeling Method of Material Removal Depth in CNC Mechanical Polishing for Aluminum Alloy Wheel

铝合金车轮CNC机械抛光材料去除深度建模方法研究