However,it isn’t shown that measuring result is affected by wire bond pulling test point position and wire radian.
随着现代封装技术的高速发展,对于封装产品质量的检测要求越来越严格,而键合拉力测试是封装产品质量检测中的重要一项,而在相关标准上并未对键合拉力测试点及键合线弧度对测量结果所产生的影响给出明确的规定。
A measuring workholder of bonding force was set up.
建立了超声键合压力的测量工作台,对工作台进行静态线性度标定和动态重复性测量,利用动态压电测力传感器对超声键合系统键合压力大小进行测量,得出不同压力作用下传感器力响应曲线图,分析其频谱图,发现保持某一固定功率(4。
The characteristics of bonding force in the ultrasonic bonding process were also studied.
本文以TS2100超声键合机换能系统为主要研究对象,以阻抗分析仪和激光多普勒测速仪为测量仪器,针对换能系统劈刀和肋环夹持等因素的影响,对换能系统进行了较为系统的研究,包括换能系统电学导纳特性,换能系统俯仰方向的低频振动特性等;并对超声键合过程中键合压力及谐振频率等特性进行了研究。
In ultrasonic wire bonding process,the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中,键合压力是影响键合强度的重要因素之一。
This paper was based on the ultrasonic bonding flat and it was main about the influence to the the bonding quality and the characteristic of ultrasonic wire bonding system which came from different capillary mounted lengthes and bonding pressures.
本文以超声键合实验平台为基础,围绕劈刀安装长度、键合压力等不同工艺参数对引线键合质量及超声换能系统的影响展开。
Effects of bonding pressure on nonlinear dynamic behavior of an ultrasonic vibration
键合压力对超声换能系统非线性混沌特性的影响
Stress Damage on Vertical Structure GaN-Based LEDs
垂直结构GaN基LEDs热压键合应力损伤分析
Mining Field Pressure and Coalbed Gas Seepage Solid-Gas Coupled Study in the Condition of Composite Key Stratum
复合关键层下采场压力及煤层瓦斯渗流耦合规律研究
Residual bond structure analysis of equilibrium phase diagram of Al-Si and Mg-Al alloys under pressure condition
压力对Al-Si和Mg-Al合金平衡相图作用的残余键结构分析
To exert downward pressure on(a button or keyboard, for example;press.
按,压下在(按钮或键盘上)施加向下的压力;压,按
avoid hard knocks and unduly strong key pressing
不要用力敲击及大力按压按键
Study Research on Key Technologies for WOFDM in Low-Voltage Power-Line
低压电力线WOFDM关键技术的研究
Development of the Key Components and the Pressing Force Control System of the RYJ-Ⅱ Hot-embossing Equipment;
RYJ-Ⅱ型热压设备关键部件研制及压力系统研究
Research on the Key Technology of Underwater Hydraulic System Utilizing Seawater Pressure
基于海水压力的水下液压系统关键技术研究
Design of High Voltage Pulse Power for Anodic Bonding and Study on the Processing Property of Bonding;
阳极键合高压(脉冲)电源设计及键合工艺特性分析
glucosidic linkage
糖苷键[合],苷键[合]
Study on Compaction Dynamics and Key Technology of Compaction Process Control of Oscillatory Roller
振荡压路机压实动力学及压实过程控制关键技术的研究
Otherwise, operating pressure causes the labeling color to rub off on the inside of the key.
否则操作压力会使按键里面的标签颜色磨去。
Finite Element Analysis and Mechanics Performance of Hydraulic Excavator's Key Part;
液压支架关键部件力学性能有限元分析
Research and Implementation of Key Technology of MV-PLC OFDM Modem Based on DSP;
基于DSP的OFDM中压电力线Modem关键技术研究与实现
Research on some Key Techniques of MEMS High Temperature Pressure Transducer;
MEMS高温压力传感器若干关键技术的研究
Researches on Theory and Some Key Problems of Power System Voltage Stability;
电力系统电压稳定理论若干关键问题研究
Key Technique in Handle Surface Pressure Distribution Test System Design
手柄曲面压力分布测试系统设计关键技术
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